Diamond Edge Grinding Wheel
Edge Grinding Wheel, Metal Bonded Wheel, Diamond Grinding Wheel manufacturer / supplier in China, offering Diamond Edge Grinding Wheel, Peripheral Diamond Grinding Wheel of (PCD / CBN), Grinding Wheel (For silicon D230) and so on.
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Product Introduction
Diamond Edge Grinding Wheel
Basic Info
Model NO.: customized
Abrasive: Superabrasive
Types: Edge Grinding Wheel
Cylindricity: Customized
Technics: Metal Bonded
Standard: Jb/T 7425-2012
Brand: Diasc
Package: Carton
Origin: Cn
Material: Metal Bonded
Shapes: Disc
Grain Size: Customized
Circular Degree: Customized
Working Style: Edge Grinding
Dressing: Can Be Dressed
Trademark: diasc
Specification: customized
HS Code: 68042100
Product Description
Details
Metal bond diamond wheels are used for edge grinding of silicon wafers.
Grinding wheel for bevel machining of semiconductor material substrates.
Thanks to a design featuring a uniform layer of fine grains and high-precision finishing technology, this grinding wheel makes high-quality, high-precision machining possible with minimal chipping.
Both outer-circumference machining and notch machining wheels are available in three types: Single-groove, multi-groove, and composite rough finishing.
Features
Even and ne diamond layer minimizes processing damage.
Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life.
Highly precise slotted shape and nishing technology support various wafer shapes.
Copper-less supported.
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